Laser: 1064nm IR laser
Wafer Size: 2″ and 4″; 6″ optional
Applications: DBR LED Wafer Scribing
Laser scribing speed, programmable
Scribed pattern, definable
High accuracy camera for alignment
SS-300 is a production IR laser SD scribing tool designed for
manufacturing of high-brightness LED wafers. The beam delivery path is
flexible, where beam diameter adjustments, laser power adjustment, and
shutter control can be individually controlled. The granite optics plate
is essential for stable optical and mechanical performance. SS-300 is a
Class I laser safe system; and it is also equipped with debris removal
system to keep the work piece clean.
SS-300 offers excellent wafer alignment capabilities as next generation LED wafers require ever more precise alignment than before. The high-accuracy Rotary tuntable can position the wafer precisely under laser beam for processing. A high-magnification camera can detect wafer edges or dies on the wafer precisely, enabling previse overlay of laser-scribing patterns.
The application software of SS-300 offers easy-to-use friendly user interface, allowing recipe creation, editing, saving and loading, making wafer processing highly efficient. For each SS-300 system, we evaluate customer-specific requirements and plans so we can customize the tool to better suit individual customer needs.