LA is a new process for high efficiency solar cell fabrication. The key point of this process is choosing the proper laser to ablate on the backside of the wafer, i.e. to remove or create windows on the passivation layer of the wafer, optimizing the laser processing window to improve performance of the wafer. Back side passivation reduces the carrier recombination on the back surface and therefore effectively raised the efficiency of solar cells.

Features

• Minimizes damages to the substrate

• Higher open circuit voltage (Voc)

• Excellent backside ohmic contact